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features description/ordering information sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 members of the texas instruments widebus? family output ports have equivalent 22- w series resistors, so no external resistors are required support mixed-mode signal operation (5-v input and output voltages with 3.3-v v cc ) support unregulated battery operation down to 2.7 v typical v olp (output ground bounce) <0.8 v at v cc = 3.3 v, t a = 25 c i off and power-up 3-state support hot insertion bus hold on data inputs eliminates the need for external pullup/pulldown resistors distributed v cc and gnd pins minimize high-speed switching noise flow-through architecture optimizes pcb layout latch-up performance exceeds 500 ma per jesd 17 esd protection exceeds jesd 22 ? 2000-v human-body model (a114-a) ? 200-v machine model (a115-a) ordering information t a package (1) orderable part number top-side marking fbga ? grd 74lvth162244grdr reel of 1000 ll2244 fbga ? zrd (pb-free) 74lvth162244zrdr tube of 25 sn74lvth162244dl sn74lvth162244dlg4 ssop ? dl lvth162244 sn74lvth162244dlr reel of 1000 ?40 c to 85 c 74lvth162244dlrg4 sn74lvth162244dggr tssop ? dgg reel of 2000 74lvth162244dggrg4 lvth162244 74lvth162244gre4 vfbga ? gql sn74lvth162244kr reel of 1000 ll2244 vfbga ? zql (pb-free) 74lvth162244zqlr ?55 c to 125 c cfp ? wd tube SNJ54LVTH162244WD SNJ54LVTH162244WD (1) package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. widebus is a trademark of texas instruments. production data information is current as of publication date. copyright ? 1993?2006, texas instruments incorporated products conform to specifications per the terms of the texas on products compliant to mil-prf-38535, all parameters are instruments standard warranty. production processing does not tested unless otherwise noted. on all other products, production necessarily include testing of all parameters. processing does not necessarily include testing of all parameters. www.ti.com sn54lvth162244 . . . wd p ackage sn74lvth162244 . . . dgg or dl p ackage (t op view) 12 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 4847 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1oe 1y11y2 gnd 1y31y4 v cc 2y12y2 gnd 2y32y4 3y1 3y2 gnd 3y33y4 v cc 4y14y2 gnd 4y34y4 4oe 2oe 1a11a2 gnd 1a3 1a4 v cc 2a12a2 gnd 2a3 2a4 3a1 3a2 gnd 3a3 3a4 v cc 4a14a2 gnd 4a3 4a4 3oe
description/ordering information (continued) sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 the 'lvth162244 devices are 16-bit buffers and line drivers designed for low-voltage (3.3-v) v cc operation, but with the capability to provide a ttl interface to a 5-v system environment. these devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. these devices provide true outputs and symmetrical active-low output-enable ( oe) inputs. the outputs, which are designed to source or sink up to 12 ma, include equivalent 22- w series resistors to reduce overshoot and undershoot. active bus-hold circuitry holds unused or undriven inputs at a valid logic state. use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. when v cc is between 0 and 1.5 v, the devices are in the high-impedance state during power up or power down. however, to ensure the high-impedance state above 1.5 v, oe should be tied to v cc through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. these devices are fully specified for hot-insertion applications using i off and power-up 3-state. the i off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. the power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. 2 submit documentation feedback www.ti.com
abc sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 terminal assignments (1) (56-ball gql/zql package) 1 2 3 4 5 6 a 1 oe nc nc nc nc 2 oe b 1y2 1y1 gnd gnd 1a1 1a2 c 1y4 1y3 v cc v cc 1a3 1a4 d 2y2 2y1 gnd gnd 2a1 2a2 e 2y4 2y3 2a3 2a4 f 3y1 3y2 3a2 3a1 g 3y3 3y4 gnd gnd 3a4 3a3 h 4y1 4y2 v cc v cc 4a2 4a1 j 4y3 4y4 gnd gnd 4a4 4a3 k 4 oe nc nc nc nc 3 oe abc abc (1) nc ? no internal connection terminal assignments (1) (54-ball grd/zrd package) 1 2 3 4 5 6 a 1y1 nc 1 oe 2 oe nc 1a1 b 1y3 1y2 nc nc 1a2 1a3 c 2y1 1y4 v cc v cc 1a4 2a1 d 2y3 2y2 gnd gnd 2a2 2a3 e 3y1 2y4 gnd gnd 2a4 3a1 f 3y3 3y2 gnd gnd 3a2 3a3 g 4y1 3y4 v cc v cc 3a4 4a1 h 4y3 4y2 nc nc 4a2 4a3 j 4y4 nc 4 oe 3 oe nc 4a4 (1) nc ? no internal connection function table (each 4-bit buffer) inputs output y oe a l h h l l l h x z 3 submit documentation feedback www.ti.com gql or zql p ackage (t op view) j h g f e d c b a 2 1 3 4 6 5 k grd or zrd p ackage (t op view) j h g f e d c b a 2 1 3 4 6 5
absolute maximum ratings (1) sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 logic diagram (positive logic) over operating free-air temperature range (unless otherwise noted) min max unit v cc supply voltage range ?0.5 4.6 v v i input voltage range (2) ?0.5 7 v v o voltage range applied to any output in the high-impedance or power-off state (2) ?0.5 7 v v o voltage range applied to any output in the high state (2) ?0.5 v cc + 0.5 v i o current into any output in the low state 30 ma i o current into any output in the high state (3) 30 ma i ik input clamp current v i < 0 ?50 ma i ok output clamp current v o < 0 ?50 ma dgg package 70 dl package 63 q ja package thermal impedance (4) c/w gql/zql package 42 grd/zrd package 36 t stg storage temperature range ?65 150 c (1) stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) the input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (3) this current flows only when the output is in the high state and v o > v cc . (4) the package thermal impedance is calculated in accordance with jesd 51-7. 4 submit documentation feedback www.ti.com 1oe 1a11a2 1a3 1a4 1y11y2 1y3 1y4 147 46 44 43 23 5 6 2oe 2a12a2 2a3 2a4 2y12y2 2y3 2y4 4841 40 38 37 89 11 12 3oe 3a13a2 3a3 3a4 3y13y2 3y3 3y4 2536 35 33 32 1314 16 17 4oe 4a14a2 4a3 4a4 4y14y2 4y3 4y4 2430 29 27 26 1920 22 23 pin numbers shown are for the dgg, dl, and wd packages.
recommended operating conditions (1) electrical characteristics sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 sn54lvth162244 sn74lvth162244 unit min max min max v cc supply voltage 2.7 3.6 2.7 3.6 v v ih high-level input voltage 2 2 v v il low-level input voltage 0.8 0.8 v v i input voltage 5.5 5.5 v i oh high-level output current ?12 ?12 ma i ol low-level output current 12 12 ma d t/ d v input transition rise or fall rate outputs enabled 10 10 ns/v d t/ d v cc power-up ramp rate 200 200 m s/v t a operating free-air temperature ?55 125 ?40 85 c (1) all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. refer to the ti application report, implications of slow or floating cmos inputs, literature number scba004. over recommended operating free-air temperature range (unless otherwise noted) sn54lvth162244 sn74lvth162244 parameter test conditions unit min typ (1) max min typ (1) max v ik v cc = 2.7 v, i i = ?18 ma ?1.2 ?1.2 v v oh v cc = 3 v, i oh = ?12 ma 2 2 v v ol v cc = 3 v, i ol = 12 ma 0.8 0.8 v v cc = 0 or 3.6 v, v i = 5.5 v 10 10 control v cc = 3.6 v, v i = v cc or gnd 1 1 inputs i i m a v i = v cc 1 1 data inputs v cc = 3.6 v v i = 0 ?5 ?5 i off v cc = 0, v i or v o = 0 to 4.5 v 100 m a v i = 0.8 v 75 75 v cc = 3 v v i = 2 v ?75 ?75 i i(hold) data inputs m a 500 v cc = 3.6 v, (2) v i = 0 to 3.6 v ?750 i ozh v cc = 3.6 v, v o = 3 v 5 5 m a i ozl v cc = 3.6 v, v o = 0.5 v ?5 ?5 m a i ozpu v cc = 0 to 1.5 v, v o = 0.5 v to 3 v, oe = don't care 100 (3) 100 m a i ozpd v cc = 1.5 v to 0, v o = 0.5 v to 3 v, oe = don't care 100 (3) 100 m a outputs high 0.19 0.19 v cc = 3.6 v, i cc i o = 0, outputs low 5 5 ma v i = v cc or gnd outputs disabled 0.19 0.19 v cc = 3 v to 3.6 v, one input at v cc ? 0.6 v, d i cc (4) 0.2 0.2 ma other inputs at v cc or gnd c i v i = 3 v or 0 4 4 pf c o v o = 3 v or 0 9 9 pf (1) all typical values are at v cc = 3.3 v, t a = 25 c. (2) this is the bus-hold maximum dynamic current. it is the minimum overdrive current required to switch the input from one state to another. (3) on products compliant to mil-prf-38535, this parameter is not production tested. (4) this is the increase in supply current for each input that is at the specified ttl voltage level, rather than v cc or gnd. 5 submit documentation feedback www.ti.com
switching characteristics sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 over recommended operating free-air temperature range, c l = 50 pf (unless otherwise noted) (see figure 1 ) sn54lvth162244 sn74lvth162244 from to v cc = 3.3 v v cc = 3.3 v parameter v cc = 2.7 v v cc = 2.7 v unit (input) (output) 0.3 v 0.3 v min max min max min typ (1) max min max t plh 1.1 4.6 5.1 1.4 3.4 4 4.8 a y ns t phl 1.1 3.9 4.5 1.2 2.9 3.6 4.1 t pzh 1.1 5.4 6.7 1.2 3.9 5.1 6.5 oe y ns t pzl 1.3 4.9 6.1 1.4 3.8 4.5 5.8 t phz 1.6 5.9 6.5 2.2 4.4 5.0 5.4 oe y ns t plz 1 5.9 5.8 2 4.2 5.0 5.4 t sk(lh) 0.5 ns t sk(hl) 0.5 (1) all typical values are at v cc = 3.3 v, t a = 25 c. 6 submit documentation feedback www.ti.com
parameter measurement information sn54lvth162244 , , sn74lvth162244 3.3-v abt 16-bit buffers/drivers with 3-state outputs scbs258n ? june 1993 ? revised november 2006 figure 1. load circuit and voltage waveforms 7 submit documentation feedback www.ti.com t h t su from output under t est c l = 50 pf (see note a) load circuit s1 6 v gnd 500 w 500 w data input t iming input 2.7 v0 v 2.7 v 0 v 2.7 v0 v t w input volt age w aveforms setup and hold times volt age w aveforms propaga tion dela y times inverting and noninverting outputs volt age w aveforms pulse dura tion t plh t phl t phl t plh v oh v oh v ol v ol 2.7 v0 v input output control output w aveform 1 s1 at 6 v (see note b) output w aveform 2 s1 at gnd (see note b) v ol v oh t pzl t pzh t plz t phz 3 v 0 v v ol + 0.3 v v oh ? 0.3 v 0 v 2.7 v volt age w aveforms enable and disable times low - and high-level enabling outputoutput t plh /t phl t plz /t pzl t phz /t pzh open 6 v gnd test s1 notes: a. c l includes probe and jig capacitance. b. w aveform 1 is for an output with internal conditions such that the output is low , except when disabled by the output control. waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. c. all input pulses are supplied by generators having the following characteristics: prr 10 mhz, z o = 50 w , t r 2.5 ns, t f 2.5 ns. d. the outputs are measured one at a time, with one transition per measurement. open 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v 1.5 v1.5 v
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-9680901qxa active cfp wd 48 1 tbd a42 snpb n / a for pkg type 5962-9680901vxa active cfp wd 48 1 tbd a42 snpb n / a for pkg type 74lvth162244dggrg4 active tssop dgg 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74lvth162244dlrg4 active ssop dl 48 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74lvth162244grdr active bga mi crosta r juni or grd 54 1000 tbd snpb level-1-240c-unlim 74lvth162244gre4 active tssop dgg 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim 74lvth162244zqlr active bga mi crosta r juni or zql 56 1000 green (rohs & no sb/br) snagcu level-1-260c-unlim 74lvth162244zrdr active bga mi crosta r juni or zrd 54 1000 green (rohs & no sb/br) snagcu level-1-260c-unlim sn74lvth162244dggr active tssop dgg 48 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvth162244dl active ssop dl 48 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvth162244dlg4 active ssop dl 48 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvth162244dlr active ssop dl 48 1000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim sn74lvth162244kr active bga mi crosta r juni or gql 56 1000 tbd snpb level-1-240c-unlim SNJ54LVTH162244WD active cfp wd 48 1 tbd a42 snpb n / a for pkg type (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) package option addendum www.ti.com 6-dec-2006 addendum-page 1
(3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 6-dec-2006 addendum-page 2
mechanical data mcfp010b january 1995 revised november 1997 post office box 655303 ? dallas, texas 75265 wd (r-gdfp-f**) ceramic dual flatpack 4040176 / d 10/97 48 leads shown 48 48 25 56 0.610 (18,80) 0.710 (18,03) 0.740 0.640 0.390 (9,91) 0.370 (9,40) 0.870 (22,10) 1.130 (28,70) 1 a 0.120 (3,05) 0.075 (1,91) leads** 24 no. of a min a max (16,26) (15,49) 0.025 (0,635) 0.009 (0,23) 0.004 (0,10) 0.370 (9,40) 0.250 (6,35) 0.370 (9,40) 0.250 (6,35) 0.014 (0,36) 0.008 (0,20) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. this package can be hermetically sealed with a ceramic lid using glass frit. d. index point is provided on cap for terminal identification only e. falls within mil std 1835: gdfp1-f48 and jedec mo -146aa gdfp1-f56 and jedec mo -146ab

mechanical data msso001c ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 dl (r-pdso-g**) plastic small-outline package 4040048 / e 12/01 48 pins shown 56 0.730 (18,54) 0.720 (18,29) 48 28 0.370 (9,40) (9,65) 0.380 gage plane dim 0.420 (10,67) 0.395 (10,03) a min a max 0.010 (0,25) pins ** 0.630 (16,00) (15,75) 0.620 0.010 (0,25) seating plane 0.020 (0,51) 0.040 (1,02) 25 24 0.008 (0,203) 0.0135 (0,343) 48 1 0.008 (0,20) min a 0.110 (2,79) max 0.299 (7,59) 0.291 (7,39) 0.004 (0,10) m 0.005 (0,13) 0.025 (0,635) 0 ? 8 0.005 (0,13) notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). d. falls within jedec mo-118
mechanical data mtss003d january 1995 revised january 1998 post office box 655303 ? dallas, texas 75265 dgg (r-pdso-g**) plastic small-outline package 4040078 / f 12/97 48 pins shown 0,25 0,15 nom gage plane 6,00 6,20 8,30 7,90 0,75 0,50 seating plane 25 0,27 0,17 24 a 48 1 1,20 max m 0,08 0,10 0,50 0 8 56 14,10 13,90 48 dim a max a min pins ** 12,40 12,60 64 17,10 16,90 0,15 0,05 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated

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